DM3730 数字媒体处理器

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dm3730 数字媒体处理器

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI.

dm3730

Applications Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security

Operating Systems Android,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks    

DSP 1 C64x    

DSP Instruction Type Fixed Point    

DSP MHz (Max.) 660,800    

DSP Peak MMACS 6400    

ARM CPU 1 ARM Cortex-A8    

ARM MHz (Max.) 800,1000    

ARM MIPS (Max.) 2000    

Graphics Acceleration 1 SGX530 Graphics    

Video Capability Decode,Encode,Analytics,Image Enhance    

TI Video Codecs H.264-BP,H.264-MP/HP,JPEG,MPEG2-MP,MPEG4-SP,VC1    

Video Resolution/Frame Rate D1 or Less,720p    

TI Audio Codecs AAC-HE,AAC-LC,G.711,MP3,WMA    

On-Chip L1 Cache 64 KB (ARM Cortex-A8)    

On-Chip L2 Cache 256 KB (ARM Cortex-A8)    

General Purpose Memory Asynch SRAM,GPMC  NAND flash,NOR Flash,OneNAND    

DRAM 1 16-Bit LPDDR,1 32-Bit SDRC    

USB 4    

MMC/SD 3    

UART (SCI) 4    

I2C 4    

McBSP 5    

SPI 4    

DMA (Ch) Yes    

Video Port (Configurable) 1 Dedicated Input,1 Dedicated Output    

IO Supply (V) 1.8    

Operating Temperature Range (C) -40 to 105,0 to 90,-40 to 90    

Pin/Package 423FCBGA, 515POP-FCBGA

dm3730 特性

dm3730, DM3725 Digital Media Processors:

Compatible with OMAP™ 3 Architecture

ARM® microprocessor (MPU) Subsystem

Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz

NEON SIMD Coprocessor

High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem

POWER SGX™ Graphics Accelerator (dm3730 only)

Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core

dm3730 芯片订购指南

器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记

dm3730CBC ACTIVE 0 to 90 25.60 | 1ku POP-FCBGA (CBC) | 515 119

dm3730CBC100 ACTIVE 0 to 90 30.75 | 1ku POP-FCBGA (CBC) | 515 119

dm3730CBCA ACTIVE -40 to 105 30.75 | 1ku POP-FCBGA (CBC) | 515 1

dm3730CBCD100 ACTIVE -40 to 90 33.80 | 1ku POP-FCBGA (CBC) | 515 119

dm3730CBP ACTIVE 0 to 90 25.60 | 1ku POP-FCBGA (CBP) | 515 168

dm3730CBP100 ACTIVE 0 to 90 30.75 | 1ku POP-FCBGA (CBP) | 515 168

dm3730CBPA ACTIVE -40 to 105 30.75 | 1ku POP-FCBGA (CBP) | 515 168

dm3730CBPD100 ACTIVE -40 to 90 33.80 | 1ku POP-FCBGA (CBP) | 515 168

dm3730CUS ACTIVE 0 to 90 25.60 | 1ku FCBGA (CUS) | 423 90

dm3730CUS100 ACTIVE 0 to 90 30.75 | 1ku FCBGA (CUS) | 423 90

dm3730CUSA ACTIVE -40 to 105 30.75 | 1ku FCBGA (CUS) | 423 90

dm3730CUSD100 ACTIVE -40 to 90 33.80 | 1ku FCBGA (CUS) | 423 90

dm3730 质量与无铅数据

器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率

DM3730CBC Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBC dm3730CBC

DM3730CBC100 Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBC100 dm3730CBC100

DM3730CBCA Green (RoHS & no Sb/Br) SNAGCU   Level-3-260C-168 HR DM3730CBCA dm3730CBCA

DM3730CBCD100 Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBCD100 dm3730CBCD100

DM3730CBP Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBP dm3730CBP

DM3730CBP100 Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBP100 dm3730CBP100

DM3730CBPA Green (RoHS & no Sb/Br) SNAGCU   Level-3-260C-168 HR DM3730CBPA dm3730CBPA

DM3730CBPD100 Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CBPD100 dm3730CBPD100

DM3730CUS Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CUS dm3730CUS

DM3730CUS100 Green (RoHS & no Sb/Br) Call TI   Level-3-260C-168 HR DM3730CUS100 dm3730CUS100

DM3730CUSA Green (RoHS & no Sb/Br) SNAGCU   Level-3-260C-168 HR DM3730CUSA dm3730CUSA

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