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GLOBALFOUNDRIES HSS/DDR Application Engineer is working on cutting-edge High Speed SerDes (HSS) and DDR IP engagement and support for GLOBALFOUNDRIES worldwide clients. By employing the industry leading tools, state of the art methodology, and innovative semiconductor leading technologies ranging from 32nm to 14nm and beyond, you will be participating in:

ME/EE/CS or background in related areas.

At least 3 years industry application engineering experience.

Experience and knowledge in one or more of the following areas:

HSS or DDR customer application support

Hardware bring up and quality test support

High speed link or memory intece protocols including JEDEC, PCIE and CEI

High speed link or memory intece design and verification experience is a plus

High speed board design and validation experience is a plus

Good understanding of chip backend design flow and methodology.

Able to conduct flexible hour technical meetings, seminars and trainings to customers.

Business travel within greater China region is required.

Good English skills, communication skills, and willingness to work with a global team. Skill in other languages is a plus.

Good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment.

GLOBALFOUNDRIES has successfully completed the acquisition of IBM's microelectronics business on July 1, 2015. In China, the former IBM China Chip Design Center is now officially a part of GLOBALFOUNDRIES. It is a major step towards securing industry leadership. First, the acquisition reflects our company’s long-term commitment to investing in R&D for technology leadership. We have strengthened our team with some of the brightest and most innovative people in the industry. We have substantially increased our intellectual property making GLOBALFOUNDRIES the holder of one of the largest semiconductor patent portfolios in the world. Moreover, we have expanded our product portfolio with technology differentiation for RF and wired/wireless communications solutions and technology leadership in Front-End Modules for mobile applications and ASICs for wired communications on advanced technology nodes.

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