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Location: Shanghai,
Responsibilities:
HSS/DDR Application Engineer is working on cutting-edge High Speed SerDes (HSS) and DDR IP engagement and support for company's worldwide clients. By employing the industry leading tools, state of the art methodology, and innovative semiconductor leading technologies ranging from 32nm to 14nm and beyond, you will be participating in:
Provide direct technical customer support and assistance to enable customers to successfully use HSS/DDR in their chip
Engage in hardware bring up and quality test support, including issue debug, electrical parameter measurement and HSS/DDR intece/register ysis
Enable physical integration of HSS/DDR in backend design process
Provide customer feedback on requirements for HSS/DDR to internal development team
Provide customer reference of board level circuit design on HSS/DDR intece
Write application notes and review specifications for HSS/DDR
Requirements:
1. ME/EE/CS or background in related areas.
2. At least 3 years industry application engineering experience.
3. Experience and knowledge in one or more of the following areas:
HSS or DDR customer application support
Hardware bring up and quality test support
High speed link or memory intece protocols including JEDEC, PCIE and CEI
High speed link or memory intece design and verification experience is a plus
High speed board design and validation experience is a plus
4. Good understanding of chip backend design flow and methodology.
5. Able to conduct flexible hour technical meetings, seminars and trainings to customers.
6. Business travel within greater China region is required.
7. Good English skills, communication skills, and willingness to work with a global team. Skill in other languages is a plus.
8. Good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment.
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