throwing power_plating_standard potential

ThrowingPowerExperienceatTPandFP20050823ThrowingPowerExperienceatCupracidTPandFPDate:August23,2005February2002KennyThrowingPowerExperienceIntroductionFebruary2002KennyThrowingPowerExperienceIntroductionCupracidFPisdesignedforgoodlevellingapplicationCupracidTPismainlydesignedforhighqualitycopperplatingprocess.Itproducedexcellentthrowingpowerandlevelling.BothchemistrieshavebeenevaluatedunderthesamecopperplatingtankinAtotechTechnicalCentreGZfordifferentcustomersbefore.Theirthrowingpower(minimum)resultswereusedforcomparison.Unfortunately,theaspectratiooftestboardsweredifferentduringevaluation.February2002KennyThrowingPowerExperienceIntroductionTestBoarddimensionduringCupracidFPevaluation:BoardThickness=1.6mman……

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